AP1069 is a Power Amplifier Module for WCDMA/TDMA applications. The MMIC is
fabricated using advanced InGaP HBT technology and offers high power, high linearity,
high efficiency, stable and reliable performance. It is packaged in a 10-pin industry compatible 4mm x 4mm Land Grid Array (LGA) surface mount module and self-contained with input and output matching networks optimized for 50Ω system to minimize the use of external components.

Applications

• WCDMA
• TDMA

More information please refer to http://www.rfintc.com/html/handset_pam_ap1069.htm or contact Mr. Jacky Su  at Seraphim,Taiwan distributor of RFIC, tel: 26984660 ext. 216 or email to jackysu@seraphim.com.tw

Vendor:

RFIC Technology Corporation